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PCBGOO Capabilities

PCBGOO has prototype PCB, PCB Production fabrication and pcb assembly capabilities.

Many users of PCBs find ceramic PCBs have an advantage over traditional PCBs made of other materials. This advantage is because ceramic PCBs provide suitable substrates for electronic circuits with high thermal conductivity and low coefficient of thermal expansion (CTE).

The ceramic PCB is extremely versatile and can replace a complete traditional PCB with a less complex design and increased performance. You can use them in multiple products, like high-power circuits, chip-on-board modules and proximity sensors.

Main Ceramic PCB Types

From the level of substrates, ceramic PCBs include the aluminum, AIN, BeO, Si₃N₄, hybrid substrate boards, etc. From the layers of the circuit boards, there are the single-layer, double-layer, and multilayer.

Ceramic PCBs are usually made up of ceramic cores, with alumina and aluminum nitride (AIN) being two of the primary types. Both of these kinds of boards provide better thermal performance than metal core PCBs because there isn’t a need for an electric layer between the core and the circuits. Find out more about these two main kinds of ceramic PCB types below:

AIN: For high thermal conductivity, aluminum nitride boards are ideal, providing greater than 150 w/mK. AIN is a top choice for may other reasons as well, such as its good dielectric properties, non-reactiveness with various semiconductor process chemicals and low CTE.

Alumina: Since aluminum nitride board are expensive, those opting for less expensive ceramic PCBs may find themselves with Alumina boards. These PCBs are made out of aluminum oxide and offer about 18-36 w/mK.

Advantages of Ceramic PCB

Safe operation in temperatures up to 350 degrees Celsius

Simple implementation of high-density circuit tracing

Exceptional high-frequency performance

Versatile packaging, with an option to come in hermetic packages to prevent water absorption

Tough chemical erosion resistance

Another ceramic PCB advantage is a lower overall system cost, which can be especially cost-effective for dense packages, since you have parallel processing of layers.


Item
Capability
Layers
1-30
Thicker Copper
1-6OZ
Products Type
HF(High-Frequency)&RF(Radio Frequency) board, Impedance controlled board , HDI board ,

BGA & Fine Pitch board

Solder Mask
Nanya & Taiyo; LPI & Matt Red, green, yellow, white, blue, black.
Base material
FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic, Argon and so on
Finished Surface
Conventional HASL, Lead-free HASL, Falsh Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, ImmersionSilver, Hard Gold
Selective Surface Treatment
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger, Flash Gold +Gold Finger,

Immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification
Minimum line width/gap: 3.5/4mil(laser drill)
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size: 900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers: 0.40-7.0mm
Min Solder Mask Bridge: 0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance
Plated holes Tolerance: 0.08mm(min±0.05)
Non-plated hole tolerance: 0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: 0.15min(min±0.10mm)
Insulating resistance: 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test: 2650c, 20 seconds
Solder mask hardness: 6H
E-Test voltage: 500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )