86-755-82598236 sales@pcbgoo.com

PCBGOO Capabilities

PCBGOO has prototype PCB, PCB Production fabrication and pcb assembly capabilities.


PCB and LED

With the innovation of science and technology, we get to see more simplified and easy to use inventions every day. One of the inventions is the Printed Circuit Board, it using conductive tracks to connect various components of the board, and mechanically supporting these components. Because of the advantage of making more complex and large scale circuits with less apace and material, printed circuit boards are widely used in industrial control, communication equipment, medical equipment, and automobile electronics.

An LED (Light Emitting Diode) is a two-lead semiconductor device that emits light when the current passes through it in a certain direction. Because this device’s configuration is limited to one direction, in some cases LEDs can be used to make patterns or provide indication signals. With the development of technology, modern LEDs not only can provide high intensity and very bright light, but also provide many types, such as visible light, ultraviolet light, and infrared light.

LED PCB

After understood the concept behind PCBs and LEDs, the next step is come to LED PCBs. Basically an LED PCB can be defined as an LED soldered into a PCB as a chip that lights up whenever the circuit is connected in a certain way. These type of PCBs normally also hold a thermal sink and a ceramic base to hold the circuit in place and allow smooth running of the circuit. The thermal sink is a necessity because an LED tends to produce high amounts of heat, which could potentially damage the PCB and the device in which the circuit is connected.

Because of the high levels of heat produced by LEDs, these devices are preferred to be attached to printed circuit boards that have a metal base. The metal based boards have the ability to quickly dissipate heat and to be a better option for designer. Normally, an aluminum based printed circuit board is preferred, it normally also contains a thin layer of dielectric that allows quicker heat dissipation.

LED PCBs are becoming the go to solution for lighting purposes for a number of reasons. Firstly, as discussed earlier, the LED designs today are available not only for high quality and high intensity purposes but are also available in visible, infrared and ultraviolet light. Secondly, more flexible for design of PCBs. Thirdly, they are easy to use and cost effective as compared to other options that provide similar functioning. Last but not least, LEDs offer greater energy efficiency as well. Some applications of LED printed circuit boards include: street lights, lighting used in field of runways or military, flashlights and lanterns, hospital operating room lighting, vehicle headlights, etc.

Understanding the immeasurable importance of LED printed circuit boards in the electronics and circuit board industry, the next question is where to get the best LED printed circuit boards. At PCBGOO , the leading LED printed circuit board and PCBA manufacturer, you are guaranteed to get the best price and quality. To know more about LED printed circuit boards, welcome to contact us via

www.pcbgoo.com



Item
Capability
Layers
1-30
Thicker Copper
1-6OZ
Products Type
HF(High-Frequency)&RF(Radio Frequency) board, Impedance controlled board , HDI board ,

BGA & Fine Pitch board

Solder Mask
Nanya & Taiyo; LPI & Matt Red, green, yellow, white, blue, black.
Base material
FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic, Argon and so on
Finished Surface
Conventional HASL, Lead-free HASL, Falsh Gold, ENIG (Immersion Gold), OSP(Entek), Immersion Tin, ImmersionSilver, Hard Gold
Selective Surface Treatment
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger, Flash Gold +Gold Finger,

Immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification
Minimum line width/gap: 3.5/4mil(laser drill)
Minimum hole size: 0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size: 900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers: 0.40-7.0mm
Min Solder Mask Bridge: 0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance
Plated holes Tolerance: 0.08mm(min±0.05)
Non-plated hole tolerance: 0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: 0.15min(min±0.10mm)
Insulating resistance: 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test: 2650c, 20 seconds
Solder mask hardness: 6H
E-Test voltage: 500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )