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PCBGOO Capabilities

PCBGOO has prototype PCB, PCB Production fabrication and pcb assembly capabilities.

A Single Sided PCB is the most basic type of printed circuit board. It consists of only one conductive copper layer above the substrate. The electrical components are soldered or mounted on to one side of the board and the entire etched circuit can be seen on the other side of the board.

Single Sided Printed Circuit Boards are easy to design and manufacturing. They are also the most cost-effective PCBs.

Since these boards have only one conducting layer the conductive paths cannot cross or overlap and thus tend to take up a large amount of space. Due to this such PCBs are ideal for low-density design requirements.

Key features of Single-Sided PCB

-Low manufacturing and production cost
-Suitable for Low Density Designs
-Easy to manufacturing and design
-Easy to repair in case something goes wrong

Application of Single Sided PCB

Single sided PCBs are generally used in designs of low density and easy electronics. They can be designed and manufactured easily and quickly. Though single sided printed circuit boards are easy and simple, they are used by many electronic companies in the world in several electronic devices and gadgets: LED Lights / Calculator / Many sensors / Power supply / Timers / Radio / Printers / Camera

Item
Capability
Layers
1-30
Thicker Copper
1-6OZ
Products Type
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board
Solder Mask
Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material
FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on
Finished Surface
Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger,immersion Silver+ Gold Finger, Immersion Tin+Gold Finger
Technical Specification
Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance
Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )